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NANOPACK Workshop on Thermal Management (23-24 May, Palaiseau, France)

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Welcome to the NANOPACK workshop on Thermal Management, held in THALES Research & Technology, Palaiseau, France on 23rd & 24th May, 2011


The European Commission ICT theme is funding since 2007 our large-scale project entitled “NANOPACK - Nano Packaging Technology for Interconnect and Heat Dissipation” (www.nanopack-project.fr ). The 14 partners of the project include major industries such as Thales (France), Bosch (Germany), IBM (Zürich Research Laboratories), SMEs and different academic teams throughout eight countries of the European Union.As a mean to gather scientists working on Thermal Interface Materials, advanced nanoscale-based heat transfer technologies and companies interested in better products, we are organizing a workshop to present the most up-to-date results and material performances for the next generations of cooling devices and processes in the automotive and industrial electronics sectors. The workshop will take in place in Palaiseau on Monday 23rd and Tuesday 24th of May.Please find attached the first version of NANOPACK workshop program.
To attend this event please just send a e-mail to Christine COMTE (christine.comte@thalesgroup.com) as soon as posssible.

 

Agenda of the workshop

Access Map

 

Yours sincerely,

Afshin ZIAEI
coordinator of NANOPACK project

 
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Project co-funded by the European Commission under the "Information and Communication Technologies" Seventh Framework Programme (2007-2013)
 
Contact: Dr. Afshin Ziaei, NANOPACK Coordinator, afshin.ziaei@thalesgroup.com